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Semiconductor

Chip Industry’s Technical Paper Roundup: Mar. 28

Time Stamp: March 28, 2023 3:01 AM
Source Node: 2457819

Republished By Plato

Industry Research

GAAFETs; thermal simulation in 3DIC; zero trust environments; silicon photonics MEMS; semi-metals for interconnects; logic locking at the RTL; mechanical overtone frequency combs; photonics: GaSb/SiN tunable hybrid integrated laser; domain wall-magnetic tunnel junction analog content addressable memory.

New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper	Research Organizations

ReTrustFSM: Toward RTL Hardware Obfuscation-A Hybrid FSM Approach	University of Florida
Photonics: GaSb/SiN Tunable Hybrid Integrated Laser	Tampere University
Exploring Topological Semi-Metals for Interconnects	Penn State, IBM, and Rice University, with funding by Semiconductor Research Corporation (SRC)
DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design	UCSB and Cadence
A Review of the Gate-All-Around Nanosheet FET Process Opportunities	IBM Research Albany
Integrated silicon photonic MEMS	EPFL, University of Sydney, CSEM, KTH Royal Institute of Technology, Ghent University, Imec, and Tyndall National Institute
Mechanical overtone frequency combs	Delft University of Technology, Ahmedabad University and NIST
Towards Hardware-Based Application Fingerprinting with Microarchitectural Signals for Zero Trust Environments	Air Force Institute of Technology
Domain Wall-Magnetic Tunnel Junction Analog Content Addressable Memory Using Current and Projected Data	UT Austin and Samsung Advanced Institute of Technology (SAIT)

If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us posting links to papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate.

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Linda Christensen

Linda Christensen

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Linda Christensen is vice president of operations and a contributing writer at Semiconductor Engineering.

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Source: https://semiengineering.com/chip-industrys-technical-paper-roundup-mar-28/

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